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Process Director (wafer Bump)

People Profilers

Singapore1 month ago
60 views27 saves12 applies

Job Type

full time

Description

Summary

Plan and direct all aspects of engineering activities

Drive team for continuous improvement in cost, yield and quality

Responsible for setting up department KPIs

Job :

Understand customer requirements and meet/exceed customer goals

Drive team to set up stable manufacturing processes with CpK >1.67

Drive engineering discipline (use DOEs and Statistical Process Engineering tools) in cost, yield and quality improvement

Arrange training for Process Managers and Engineers.

Deploy FDC and SPC on key equipment

Partnership with cross functional teams to meet production schedules, quality and safety

Customer engineering and issues resolution

Requirement

Degree in Electrical/Electronics/Mechanical/Chemical Engineering/Chemistry or its equivalent with minimum of 15 years engineering experience in wafer fab or wafer bumping house, with at least 5 years management experience at Director/Deputy Director level in a fast moving environment

Thorough knowledge of wafer level packaging, engineering and production

Have experience in setting up FDC and SPC

All Successful candidates can expect a very competitive remuneration package and a comprehensive range of benefits.

Please email your resume in a detailed MS Word format to joyce@peopleprofilers.com stating

1) Current Drawn

2) Expecting Salary

3) Date Available

4) Reason to Leave each job:

We regret that only shortlisted candidates will be notified

Joyce Koh Ai Leng

People Profilers Pte Ltd

20 Cecil St, #08-09, PLUS Building, Singapore 049705

Tel: 6950 9737

www.peopleprofilers.com

EA License Number: 02C4944

EA Personnel Reg nos R1110618

Job ID:

This job is found at InterviewStack.io

Skills

spcquality improvement

About People Profilers

Recruitment Agency Malaysia: EOR, Payroll & HR Services by People Profilers. Trusted talent solutions across Southeast Asia since 2002.

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