About the Role

Our client, a global supplier of high-precision die bonding and micro-assembly equipment, is building out its APAC service capability from its new Thailand office and is seeking a Service & Support Manager to lead technical service and customer support across Thailand and the wider APAC region.

This is a senior role with regional ownership, suited to an experienced service leader from semiconductor equipment, precision automation, or a comparable high-tech environment.

Key Responsibilities

• Define and execute the service strategy for Thailand and APAC, aligned with global service standards
• Track and improve service KPIs, including response times, resolution rates, and customer satisfaction
• Plan resourcing and engineering capacity across the region
• Manage customer escalations, ensuring rapid resolution and clear stakeholder communication
• Coordinate with headquarters on technical issues, product feedback, and field engineering matters
• Oversee spare parts management, tooling, and field support logistics
• Drive process improvements across the service function
• Lead, mentor, and develop the regional technical service team

What We're Looking For

• Proven experience managing technical service or field service operations, ideally within semiconductor equipment or comparable capital equipment industries
• Strong people management and team leadership track record
• Solid technical foundation with an engineering degree or equivalent experience
• Customer-first mindset with strong escalation management skills
• Familiarity with KPI-driven service operations and process improvement methodologies
• Good English communication skills, both written and spoken
• Willingness to travel within Thailand and APAC
• Must be eligible to work in Thailand

What's On Offer

• 16 days annual leave
• Performance bonus
• Group health insurance
• Travel allowance

Logistics

• Pathum Thani
• A private car is preferred due to the office location
• Full-time, permanent role

About the Company

Our client is a global supplier of high-precision die bonding and micro-assembly equipment, supporting semiconductor, photonics, and advanced packaging applications for over 30 years. With subsidiaries on three continents, they deliver local expertise and long-term technical collaboration worldwide.